Preparation and characterization of novel thermoset polyimide and polyimide-peo doped with LiCF3SO3

Novel Thermoplastic Polyimide Composite Materials

Prestressed double network thermoset: preparation and characterization

An innovative scheme to prepare Prestressed double network (PDN) epoxies is presented using a judicious combination of tetrafunctional curatives that have similar molecular weights but different reaction kinetics. A diglycidyl ether of bisphenol A epoxy monomer was reacted stoichiometrically and sequentially with various molar ratios of an aliphatic polyetheramine curing agent and an aromatic c...

A Novel Preparation of Polyimide/Clay Hybrid Films with Low Coefficient of Thermal Expansion

A novel polyimide (PI)/clay hybrid nanocomposite, designated as PI (PAAS)/CM, has been developed from the poly(amic acid) salt of triethylamine and organomontmorillonite (CM) using a mixture solution of tetrahydrofuran (THF) and methanol (MeOH). For comparison, two other PI/clay hybrids derived from poly(amic acid) and CM in THF/MeOH solution and N,N9-dimethylacetamide (DMAc) solution, denoted ...

Preparation, Characterization and Thermal Degradation of Polyimide (4-APS/BTDA)/SiO2 Composite Films

Polyimide/SiO(2) composite films were prepared from tetraethoxysilane (TEOS) and poly(amic acid) (PAA) based on aromatic diamine (4-aminophenyl sulfone) (4-APS) and aromatic dianhydride (3,3,4,4-benzophenonetetracarboxylic dianhydride) (BTDA) via a sol-gel process in N-methyl-2-pyrrolidinone (NMP). The prepared polyimide/SiO(2) composite films were characterized using X-ray diffraction (XRD), F...

Fabrication and Characterization of Polyimide/AlN Nanocomposite Films

Polymers with good insulating properties are widely used in motors, rotating machines and components in power electronics and microelectronics1-3. It is well know that polymer properties can be greatly improved by adding inorganic fillers to form composite polymer. Polyimide has been a polymer of choice in many areas owing to its excellent dielectric properties, high thermal mechanical strength...